By replacing a single component instead of discarding an entire circuit board, products can often be restored to full functionality. This makes rework a cost-effective and sustainable solution in modern electronics manufacturing.
Mitac offers BGA and LGA rework, enabling the controlled and reliable removal and replacement of advanced components. Using specialized rework equipment and carefully controlled temperature profiles, we perform precision component replacement on printed circuit boards (PCBs) according to customer specifications.
Advanced component replacement on BGA and LGA packages
BGA (Ball Grid Array) and LGA (Land Grid Array) are increasingly used in modern electronics due to their high packing density, excellent electrical performance, and efficient thermal management.
At the same time, these types of enclosures mean that repairs and component replacements require specialized equipment and process control. Since the solder joints are located beneath the component, they are not visible during assembly, which places high demands on temperature profiling, positioning, and process stability.
Mitac uses dedicated BGA rework equipment to ensure controlled and reproducible results during component replacement.
When is BGA or LGA rework used?
BGA and LGA rework is used in a variety of situations in electronics manufacturing and development:
- defective or damaged components on a circuit board
- components that need to be replaced after testing or verification
- product design changes or upgrades
- prototype and development work
- service or repair where a specific component needs to be replaced
In most cases, the cards are sent to us with clear instructions on which component needs to be replaced. We then perform the component replacement using a controlled process and specialized equipment.
Controlled rework process
In BGA and LGA rework, process control is essential to prevent damage to circuit boards or components.
The Mitacs rework process includes:
- controlled heating of both the component and the circuit board
- carefully controlled temperature profiles
- Precision positioning during component replacement
- a stable and reproducible soldering process
This minimizes the risk of, for example, pad damage, delamination, or thermal effects on the board.
A sustainable solution for electronics manufacturing
Replacing a single component instead of discarding an entire circuit board results in significant resource savings.
Through BGA replacement and PCB rework, electronics can be restored to full functionality and the product’s lifespan extended. This contributes to:
- reduced electronic waste
- more efficient use of resources
- lower material consumption
- reduced environmental impact
Rework is therefore an important part of a more circular approach to managing electronic products.
Part of Mitacs' offerings in electronics manufacturing
Mitac is a Swedish company specializing in PCB assembly and electronics manufacturing, from prototypes to mass production. By also offering BGA and LGA rework, we can support our customers throughout various stages of the product lifecycle.
We help our customers with:
- BGA component replacement
- LGA rework
- PCB rework on the customer's circuit boards
- Component replacement in prototypes and small production runs
- remanufacturing of advanced components
Learn more about our re-work initiatives here >
If you have a circuit board where a BGA or LGA component needs to be replaced, please feel free to contact us.
Adam Bergqvist
Sales/Purchasing